Printed circuit board PCB copper plating must also control various factors in the copper plating process

At present, with the development of printed circuit boards in the direction of high density and high precision, more stringent requirements are put forward for the sulfur copper plating process. Various factors in the copper plating process must be controlled at the same time to obtain high-quality plating. The following is an analysis of the reasons for the excessive consumption of chloride ions in the copper plating process. 1. The cause of excessive chloride ion consumption: the low current area of u200bu200bthe circuit board surface appears dull during copper plating, and the concentration of chlorine is low; generally after adding, the plating layer in the low current density area of u200bu200bthe board surface The phenomenon of 'non-gloss' will disappear, the chloride ion concentration in the plating solution will reach the normal range, and the plate surface will be bright. If you want to add a large amount to solve the 'dullness' phenomenon of the coating in the low current density area, it is not necessarily caused by the low chloride ion concentration, and the real reason needs to be analyzed. If you use a large amount of addition: first, it may have other consequences, and second, it will increase production costs, which is not conducive to corporate competition. 2. Correctly analyze the reason of'the coating in the low current density area is dull': add a large amount to eliminate the phenomenon of'the coating is not bright in the low current density area', indicating that if there are too few chloride ions, it needs to be added to increase the concentration of chloride ions to reach normal Range to brighten the coating in the low current density area. If you need to add doubled to make the concentration of chloride ions reach the normal range? What is consuming a large amount of chloride ions? Too high a concentration of chloride ions will cause the brightener to be consumed quickly. It shows that chloride ion and brightener will react, and excess chloride ion will be consumed; conversely, excessive brightener will also consume chloride ion. Because too few chloride ions and excessive brightener are the main reasons that the coating is not bright in the low current density area, it can be seen that the main reason for the excessive consumption of chloride ions in copper plating is that the brightener concentration is too high.