Flexible PCB Capability
A-TECH FPC business group was established in 2011, which focus on manufacturing flexible PCB from single-sided, double-sided to multilayer as well as rigid-flex PCB. The products are widely used in computers, communications network equipment, mobile phones, digital cameras, instrumentation, aerospace, automotive industry, smart appliances, lighting and other high-tech industries. Since the introduction of production equipments and manufacturing technology at home and abroad, we are committed to the development and production of stable quality and highly reliable flexible PCB boards. Special production equipments and testing instruments, expert-level technical support and services to ensure the stability of the quality of the product in flex pcb manufacturing process, and fast delivery on time, will strive to build our company into a first-class flexible printed circuit board manufacturer, professionally provide FPC manufacturing and services.
Flexible PCB Capability
No | Item | Technical data |
1 | Number of layers |
Flex:1~8layer Rigid-flex: 2-12layer |
2 | Min trace Width/Spacing |
12 &18um(base Cu):0.075/0.075mm 35um(base Cu):0.1/0.1mm |
3 | Min Space Between Coverlay Openings | 0.2mm |
4 | Edge of Coverlay Opening to Trace | 0.20mm(preferred) |
5 | Min Space between coverlay & solder pad | 0.15mm |
6 | Polyimide Films | 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ)as custmer requested. |
7 | Thermobond Adhesives | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
8 | Copper Foils (RA or ED) | 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ) |
9 | Stiffeners | PI, FR4, Stainless Steel, Aluminum, 3M Tape PSA |
10 | PI Coverlay Thickness | 0.5~5mil(0.012~0.127mm) |
11 | Surface Finish |
Electroless Ni/Au, Electrolytic soft/hard gold, Tin plating,,Imm.Tin,Entek/OSP |
12 | Solder Resists | Coverlay, Photo-Imagable Resist |
13 | Hole tolerance | ±0.05mm |
14 | Smallest Drill Size | 0.15mm |
15 | Largest Drill Size | 6.35mm |
16 | Smallest Slot Width | 0.45mm |
17 | Min.spacing between holes | 0.15mm |
18 | Minimum conductor edge to outline edge | ≥0.1mm |
19 | Min Spacing between coverlay & conductor | ± 0.15mm |
20 | Hole to outline edge | ≥ 0.10mm |
21 | Max Layer to Layer Mis-registration | ± 0.10mm |
22 | Tooling tolerances | Steel(Hard) tooling : ± 0.05mm |
CNC drill/rout : ± 0.10mm | ||
Knife(Soft) tooling : ± 0.25mm | ||
23 | Copper Plated Thickness (PTH only) | 8~15um;20~30um;30~70um(special) |
24 | Au thickness |
Electroless Ni/Au: Ni:2~6um, Au:0.035~0.075um Electrolytic soft/hard gold: Ni:2~9um, Au:0.035~0.1um |
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