Flexible PCB Capability

No Item Technical data
1 Number of layers Flex:1~8layer
Rigid-flex: 2-12layer
2 Min trace Width/Spacing 12 &18um(base Cu):0.075/0.075mm
35um(base Cu):0.1/0.1mm
3 Min Space Between Coverlay Openings 0.2mm
4 Edge of Coverlay Opening to Trace 0.20mm(preferred)
5 Min Space between coverlay & solder pad 0.15mm
6 Polyimide Films 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ)as custmer requested.
7 Thermobond Adhesives Acrylic/Modified Acrylic, Modified Epoxy, Polyimide
8 Copper Foils (RA or ED) 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
9 Stiffeners PI, FR4, Stainless Steel, Aluminum, 3M Tape PSA
10 PI Coverlay Thickness 0.5~5mil(0.012~0.127mm)
11 Surface Finish Electroless Ni/Au, Electrolytic soft/hard gold,
Tin plating,,Imm.Tin,Entek/OSP
12 Solder Resists Coverlay, Photo-Imagable Resist
13 Hole tolerance ±0.05mm
14 Smallest Drill Size 0.15mm
15 Largest Drill Size 6.35mm
16 Smallest Slot Width 0.45mm
17 Min.spacing between holes 0.15mm
18 Minimum conductor edge to outline edge ≥0.1mm
19 Min Spacing between coverlay & conductor ± 0.15mm
20 Hole to outline edge ≥ 0.10mm
21 Max Layer to Layer Mis-registration ± 0.10mm
22 Tooling tolerances Steel(Hard) tooling : ± 0.05mm
CNC drill/rout : ± 0.10mm
Knife(Soft) tooling : ± 0.25mm
23 Copper Plated Thickness (PTH only) 8~15um;20~30um;30~70um(special)
24 Au thickness Electroless Ni/Au: Ni:2~6um, Au:0.035~0.075um
Electrolytic soft/hard gold: Ni:2~9um, Au:0.035~0.1um
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