1. Rigid PCB Capability
| Project | Specification | Factory Assessment |
| Layers Count | Min-Max | 1–30L |
| Warp & Twist | <=0.75% | |
| Panel Size | Max | 510*1500MM(1 & 2L) 550*650MM(>=4L) |
| Material type | FR4，Aluminium base,High TG,Halogen-free,PTFE,Ceramic | |
| Double Layer | Copper Foil Thickness | (0.5 1 2 3 4 5 6)oz |
| Minimum Core Thickness | 0.4mm | |
| Multilayer | Copper Foil Thickness(InnerLayers) | (0.5 1 23 4 5..10)oz |
| Copper Foil Thickness(OuterLayers) | (0.5 1 2 3 4 5 6..12)oz | |
| Minimum Core Thickness | 0.1mm | |
| Minimum B-stage Thickness | 2.0mil | |
| Board Thickness | Minimum Board Thickness(Double-Sided) | 0.4mm |
| Minimum Board Thickness(MultilayersBoard) | 0.4mm | |
| Maximum Board Thickness(Double-Sided) | 3.2mm | |
| Maximum Board Thickness(MultilayersBoard) | 5.0mm | |
| Artwork—Inner layer(Signal layer) | Minimum Line width | 3mil |
| Minimum space between circuits | 3mil |
2. Rigid PCB Capability
| Project | Specification | Factory Assessment |
| Mechanical Drill(Through-holes) | Minimum Via Diameter (After Plating) | 0.15mm |
| Through holes | Maximum aspect ratio | 12:1 |
| Electroless Nickel / Immersion Gold | Minimum / Maximum Nickel Thickness | 100-200u" |
| Minimum / Maximum Gold thickness | 1-5u" | |
| Immersion Silver (over copper) | Minimum / Maximum Silver thickness | 0.1um-0.5um |
| HAL | Minimum / Maximum Solder thickness | 1um-40um |
| OSP | Minimum / Maximum Coating thickness | 0.2um-0.6um |
| Hard gold plated | Maximum Gold thickness | 50u" |
| Outer Layer Imaging | Artwork registration tolerance | 2mil |
| Artwork—Outer layer | Min line width | 3mil |
| Min line spacing | 3mil | |
| Min BGA PAD | 0.2mm | |
| Drilling | Accuracy of hole position | ±3mil |
| Space between hole edge | 12mil | |
| Line to hole size | 7mil(<8L); 8mil(>8L) | |
| Min diameter of slot hole size | 0.45mm | |
| Tolerance of PTH hole size | ±3mil |
3. Rigid PCB Capability
| Project | Specification | Factory Assessment |
| Solder Mask | Minimum opening path on pad (one side) | 3mil |
| Tolerance of exposure registration | ±2mil | |
| Minimum solder mask Thickness (Above Trace) | 10um | |
| Solder Mask | Minimum width of solder mask bridge | Copper≤1OZ: 5mil Copper≥1OZ: 8mil |
| Color of Solder Mask | green blue white red black | |
| Legend (Silkscreen) | Minimum width of legend | 0.15mm |
| Minimum height of legend | 0.7mm | |
| Routing | Min space between routing edge to copper surface | 0.25mm |
| Tolerance of routing slot | ±0.1mm | |
| V-cut | V-cut angle | 20 30 45 60 |
| Min space between V-cut edge to V-cut edge | 3mm | |
| Min space between V-cut edge to board edge | 3mm | |
| Gold Finger | Beveling angle | 30 45 60 |
| Tolerance of beveling depth | ±0.15mm | |
| Impedance Control | Tolerance | ±10% |
| Space between probes | 0.15mm |
| No | Item | Technical data |
| 1 | Number of layers | Flex:1~8layer Rigid-flex: 2-12layer |
| 2 | Min trace Width/Spacing | 12 &18um(base Cu):0.075/0.075mm 35um(base Cu):0.1/0.1mm |
| 3 | Min Space Between Coverlay Openings | 0.2mm |
| 4 | Edge of Coverlay Opening to Trace | 0.20mm(preferred) |
| 5 | Min Space between coverlay & solder pad | 0.15mm |
| 6 | Polyimide Films | 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ)as custmer requested. |
| 7 | Thermobond Adhesives | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
| 8 | Copper Foils (RA or ED) | 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ) |
| 9 | Stiffeners | PI, FR4, Stainless Steel, Aluminum, 3M Tape PSA |
| 10 | PI Coverlay Thickness | 0.5~5mil(0.012~0.127mm) |
| 11 | Surface Finish | Electroless Ni/Au, Electrolytic soft/hard gold, Tin plating,,Imm.Tin,Entek/OSP |
| 12 | Solder Resists | Coverlay, Photo-Imagable Resist |
| 13 | Hole tolerance | ±0.05mm |
| 14 | Smallest Drill Size | 0.15mm |
| 15 | Largest Drill Size | 6.35mm |
| 16 | Smallest Slot Width | 0.45mm |
| 17 | Min.spacing between holes | 0.15mm |
| 18 | Minimum conductor edge to outline edge | ≥0.1mm |
| 19 | Min Spacing between coverlay & conductor | ± 0.15mm |
| 20 | Hole to outline edge | ≥ 0.10mm |
| 21 | Max Layer to Layer Mis-registration | ± 0.10mm |
| 22 | Tooling tolerances | Steel(Hard) tooling : ± 0.05mm |
| CNC drill/rout : ± 0.10mm | ||
| Knife(Soft) tooling : ± 0.25mm | ||
| 23 | Copper Plated Thickness (PTH only) | 8~15um;20~30um;30~70um(special) |
| 24 | Au thickness | Electroless Ni/Au: Ni:2~6um, Au:0.035~0.075um Electrolytic soft/hard gold: Ni:2~9um, Au:0.035~0.1um |
| No | Item | Technical data |
| 1 | Number of Layers | 1-4Layers |
| 2 | Material | Aluminum / Copper base |
| 3 | Final Thickness | 0.5-3.2mm |
| 4 | Max Size | 1500mm x 600mm |
| 5 | Dielectric Thickness | 50, 75, 100, 125, 150, 200um |
| 6 | Min trace Width/Spacing | 4mil/4mil(0.1/0.1mm) |
| 7 | Copper Thickness | 0.5oz, 1oz, 2oz, 3oz up to 10oz |
| 8 | Min hole size | 0.6mm |
| 9 | Thermal Conductivity | 1.0-8.0W/m.K |
| 10 | Aluminum Type | 1100, 3003, 5052, 6061 etc. |
| 11 | Breakdown voltage | 2-8KV |
| 12 | Min Solder Dam | 4mil |
| 13 | Min Hole Ring | 4mil |
| 14 | Twist&amg;Bow | ≤0.7% |
| 15 | Test Voltage | 50-300V |
| 16 | Solder Mask Colour | White, Black, Red, Green, Blue, Yellow |
| 17 | Silkscreen colour | White, Black |
| 18 | Tolerance of Profile | +/-5mil |
| 19 | Peel Strength | ≥ 19N/cm |
| 20 | Dielectric Constant | 4.5~5.2 |
| 21 | Tg Value | Normal Tg(135), High Tg(170) |
| 22 | Electrical Test | 100% |
| 23 | Surface Treatment | HASL, HAL(Lead.free), Immersion Gold/Tin/Silver, OSP |
A-TECH CIRCUITS offers PCB manufacturing services for quick turn PCB prototypes, small to medium and high volume PCB orders. We understand that lead time is one of the most important demand from customers. A-TECH is structured to respond quickly to orders and provide the best lead time in PCB industry to promote competitiveness.
Please refer to our standard lead time for small to medium and high volume orders as below, our program dept will work with you to schedule orders and avoid delays. Except for standard lead time, considering some projects are quite urgent and require much shorter schedule, A-TECH is capable of offering expedited service for production orders, about the details for different cases please contact with our sales.
| SQM Layer | 1≤S＜5㎡ | 5≤S＜20㎡ | 20≤S＜50㎡ | 50≤S＜100㎡ | 100㎡≤S |
| 1 | 4-7WD | 7-9WD | 9-12WD | 12-14WD | 14-17WD |
| 2 | 5-7WD | 7-10WD | 10-13WD | 13-15WD | 15-18WD |
| 4 | 6-8WD | 8-11WD | 11-14WD | 14-16WD | 16-19WD |
| 6 | 7-9WD | 9-12WD | 12-15WD | 15-17WD | 17-20WD |
| 8 | 7-9WD | 9-12WD | 12-15WD | 15-17WD | 17-20WD |
| 10 | 8-10WD | 10-13WD | 13-16WD | 16-18WD | 18-20WD |
| 12 | 8-10WD | 10-13WD | 13-16WD | 16-18WD | 18-20WD |
| 14 | 9-11WD | 11-14WD | 14-16WD | 16-18WD | 18-20WD |
| ≤16 | Case by Case | Case by Case | Case by Case | Case by Case | Case by Case |
WD refers to Working Day
General inquiries & Customer Service
Tel: 86-755-2335 9039 | Fax: 86-755-3318 0939
E-Mail: Enquiry@atechcircuit.com
Skype: atechcircuits
Headquarters: 602, Building B3, Zhimei Huizhi Industrial Park, Fuyong Street, Bao'an District, Shenzhen City, China
Copyright © 2019 A-TECH CIRCUITS Co., Ltd. | All Rights Reserved
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