CAPABILITY

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PCB CAPABILITY

PCB CAPABILITY

2019-04-29


PCB Assembly Service
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1. Rigid PCB Capability


ProjectSpecificationFactory Assessment
Layers CountMin-Max1–30L
Warp & Twist <=0.75%
Panel SizeMax510*1500MM(1 & 2L)
550*650MM(>=4L)
Material type FR4,Aluminium base,High TG,Halogen-free,PTFE,Ceramic
Double LayerCopper Foil Thickness(0.5 1 2 3 4 5 6)oz
Minimum Core Thickness0.4mm
MultilayerCopper Foil Thickness(InnerLayers)(0.5 1  23 4 5..10)oz
Copper Foil Thickness(OuterLayers)(0.5 1 2 3 4 5 6..12)oz
Minimum Core Thickness0.1mm
Minimum B-stage Thickness2.0mil
Board ThicknessMinimum Board Thickness(Double-Sided)0.4mm
Minimum Board Thickness(MultilayersBoard)0.4mm
Maximum Board Thickness(Double-Sided)3.2mm
Maximum Board Thickness(MultilayersBoard)5.0mm
Artwork—Inner layer(Signal layer)Minimum Line width3mil
Minimum space between circuits3mil



2. Rigid PCB Capability


ProjectSpecificationFactory Assessment
Mechanical Drill(Through-holes)Minimum Via Diameter (After Plating)0.15mm
Through holesMaximum aspect ratio12:1
Electroless Nickel / Immersion GoldMinimum / Maximum Nickel Thickness100-200u"
Minimum / Maximum Gold thickness1-5u"
Immersion Silver (over copper)Minimum / Maximum Silver thickness0.1um-0.5um
HALMinimum / Maximum Solder thickness1um-40um
OSPMinimum / Maximum Coating thickness0.2um-0.6um
Hard gold platedMaximum Gold thickness50u"
Outer Layer ImagingArtwork registration tolerance2mil
Artwork—Outer layerMin line width3mil
Min line spacing3mil
Min BGA PAD0.2mm
DrillingAccuracy of hole position±3mil
Space between hole edge12mil
Line to hole size7mil(<8L); 8mil(>8L)
Min diameter of slot hole size0.45mm
Tolerance of PTH hole size±3mil



3. Rigid PCB Capability


ProjectSpecificationFactory Assessment
Solder MaskMinimum opening path on pad (one side)3mil
Tolerance of exposure registration±2mil
Minimum solder mask Thickness (Above Trace)10um
Solder MaskMinimum width of solder mask bridgeCopper≤1OZ: 5mil
       Copper≥1OZ: 8mil
Color of Solder Maskgreen blue white red black
Legend (Silkscreen)Minimum width of legend0.15mm
Minimum height of legend0.7mm
RoutingMin space between routing edge to copper surface0.25mm
Tolerance of routing slot±0.1mm
V-cutV-cut angle20 30 45 60
Min space between V-cut edge to V-cut edge3mm
Min space between V-cut edge to board edge3mm
Gold FingerBeveling angle30 45 60
Tolerance of beveling depth±0.15mm
Impedance ControlTolerance±10%
Space between probes0.15mm




Flexible PCB Capability
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NoItemTechnical data
1Number of layersFlex:1~8layer
Rigid-flex: 2-12layer
2Min trace Width/Spacing12 &18um(base Cu):0.075/0.075mm
35um(base Cu):0.1/0.1mm
3Min Space Between Coverlay Openings0.2mm
4Edge of Coverlay Opening to Trace0.20mm(preferred)
5Min Space between coverlay & solder pad0.15mm
6Polyimide Films0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ)as custmer requested.
7Thermobond AdhesivesAcrylic/Modified Acrylic, Modified Epoxy, Polyimide
8Copper Foils (RA or ED)1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
9StiffenersPI, FR4, Stainless Steel, Aluminum, 3M Tape PSA
10PI Coverlay Thickness0.5~5mil(0.012~0.127mm)
11Surface FinishElectroless Ni/Au, Electrolytic soft/hard gold,
Tin plating,,Imm.Tin,Entek/OSP
12Solder ResistsCoverlay, Photo-Imagable Resist
13Hole tolerance±0.05mm
14Smallest Drill Size0.15mm
15Largest Drill Size6.35mm
16Smallest Slot Width0.45mm
17Min.spacing between holes0.15mm
18Minimum conductor edge to outline edge≥0.1mm
19Min Spacing between coverlay & conductor± 0.15mm
20Hole to outline edge≥ 0.10mm
21Max Layer to Layer Mis-registration± 0.10mm
22Tooling tolerancesSteel(Hard) tooling : ± 0.05mm
CNC drill/rout : ± 0.10mm
Knife(Soft) tooling : ± 0.25mm
23Copper Plated Thickness (PTH only)8~15um;20~30um;30~70um(special)
24Au thicknessElectroless Ni/Au: Ni:2~6um, Au:0.035~0.075um
Electrolytic soft/hard gold: Ni:2~9um, Au:0.035~0.1um




Metal Core PCB Capability
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NoItemTechnical data
1Number of Layers1-4Layers
2MaterialAluminum / Copper base
3Final Thickness0.5-3.2mm
4Max Size1500mm x 600mm
5Dielectric Thickness50, 75, 100, 125, 150, 200um
6Min trace Width/Spacing4mil/4mil(0.1/0.1mm)
7Copper Thickness0.5oz, 1oz, 2oz, 3oz up to 10oz
8Min hole size0.6mm
9Thermal Conductivity1.0-8.0W/m.K
10Aluminum Type1100, 3003, 5052, 6061 etc.
11Breakdown voltage2-8KV
12Min Solder Dam4mil
13Min Hole Ring4mil
14Twist&amg;Bow≤0.7%
15Test Voltage50-300V
16Solder Mask ColourWhite, Black, Red, Green, Blue, Yellow
17Silkscreen colourWhite, Black
18Tolerance of Profile+/-5mil
19Peel Strength≥ 19N/cm
20Dielectric Constant4.5~5.2
21Tg ValueNormal Tg(135), High Tg(170)
22Electrical Test100%
23Surface TreatmentHASL, HAL(Lead.free), Immersion Gold/Tin/Silver, OSP




PCB Production Lead Time
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A-TECH CIRCUITS offers PCB manufacturing services for quick turn PCB prototypes, small to medium and high volume PCB orders. We understand that lead time is one of the most important demand from customers. A-TECH is structured to respond quickly to orders and provide the best lead time in PCB industry to promote competitiveness.

Please refer to our standard lead time for small to medium and high volume orders as below, our program dept will work with you to schedule orders and avoid delays. Except for standard lead time, considering some projects are quite urgent and require much shorter schedule, A-TECH is capable of offering expedited service for production orders, about the details for different cases please contact with our sales.


SQM
Layer
1≤S<5㎡5≤S<20㎡20≤S<50㎡50≤S<100㎡100㎡≤S
14-7WD7-9WD9-12WD12-14WD14-17WD
25-7WD7-10WD10-13WD13-15WD15-18WD
46-8WD8-11WD11-14WD14-16WD16-19WD
67-9WD9-12WD12-15WD15-17WD17-20WD
87-9WD9-12WD12-15WD15-17WD17-20WD
108-10WD10-13WD13-16WD16-18WD18-20WD
128-10WD10-13WD13-16WD16-18WD18-20WD
149-11WD11-14WD14-16WD16-18WD18-20WD
≤16Case by CaseCase by CaseCase by CaseCase by CaseCase by Case


WD refers to Working Day




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