RESOURCES

Printed circuit board assembly processing (hereinafter referred to as SMT) The design of printed circuit boards is one of the important components of SMT patch assembly technology. The design quality of the printed circuit board is an important symbol to measure the technical level of surface assembly, and it is one of the primary conditions for ensuring the quality of surface assembly.

At present, there are many types of PCB boards, such as high-frequency PCB boards, microwave PCB boards and other types of printed circuit boards have already gained a certain popularity in the market. PCB board manufacturers have specific processing technology for various board types. But in general, the PCB circuit board processing and production needs to consider three major aspects.

As we all know, there are many common quality problems of circuit board manufacturing, such as short circuit and open circuit, detached pad, poor soldering, etc., so users prefer to choose those with high production quality when choosing a circuit board manufacturer, so as to save a lot of trouble. So what are the factors that determine the high quality of printed circuit board manufacturers?

The quality of the PCB factory is the quality level of the PCB product, which is a collection of quality, reputation, responsibility and culture. PCB factory requirements usually have the following aspects in the article.

Flexible circuit boards are also called flexible printed circuit boards, or flexible printed circuit boards and flexible boards. According to the definition of IPC, a flexible printed circuit board is a product in which printed circuit patterns are designed and manufactured on a flexible substrate.

Speaking of the FPC flexible board cable, you must know or be familiar with what the flexible board is? FPC can be divided into many types according to function, such as FPC antenna, FPC touch screen, FPC capacitive screen, etc. FPC cable is one of them. Popularly speaking, FPC cable is a cable group that can be bent to a certain extent.

With the development of the PCB board to a high level and high precision, the alignment accuracy requirements between the layers are becoming more and more strict, and the problem of the deviation of the PCB layer is becoming more and more serious. There are many reasons for PCB board layer deviations in circuit board factories. Now we share with you a few main influencing factors of layer devistion or layer misregistration.

In high-speed PCB design, seemingly simple vias also often bring great negative effects to circuit design. In order to reduce the adverse effects caused by the parasitic effects of vias, in the design, you can do as much as possible as shown in the article.

Due to the flexibility of the FPC flexible circuit board, it is easy to break when subjected to pressure, so FPC protection requires some special methods as introduced in this article.

In order to ensure the appearance and quality of the circuit board, the PCB assembly on the surface of the circuit board has extremely high requirements for flatness. High flatness, thin lines, and high precision require strict surface defects on the circuit board substrate, especially the substrate flatness More strictly, the warpage of SMB is required to be controlled within 0.5%, while the warpage of non-SMB printed circuit boards is generally required to be 1% to 1.5%. At the same time, SMB also has higher flatness requirements for the metal plating on the pad.

The 2 layer PCB is the middle layer of dielectric, and both sides are trace layers. A multi-layer circuit board is a multi-layer wiring layer. Between each two layers is a dielectric layer, which can be made very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board.

The function of each layer in PCB design, defined layers include signal layer, protection layer, silkscreen layer, inner layer, drill layer, keep-out layer, drill drawing layer etc.

When selecting the substrate used for high-frequency PCBs, special consideration should be given to the change characteristics of the material DK at different frequencies. As for the requirements that focus on high-speed signal transmission or characteristic impedance control requirements, the focus is on the DF and its performance under conditions such as frequency, temperature and humidity.

The double-sided circuit board is the middle layer of dielectric, and both sides are trace layers. A multi-layer circuit board is a multi-layer wiring layer. Between each two layers is a dielectric layer, which can be made very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board.

Copper clad laminate: abbreviated as CCL by printed circuit board factory, or laminate. This article introduce about the various parameter of laminate, like Tg, CTI, CTE, TD, CAF, DK, DF, OZ etc.