The design rules of copper pad in PCB manufacturing

The design rules of copper pad in PCB manufacturing

The two ends of the chip components are not connected to the plug-in components. Test points should be added. The diameter of the test point is equal to or greater than 1.8mm to facilitate online tester testing.

If the IC foot pads with dense foot pitch are not connected to the hand-insertion pads, the test pads need to be added. If it is a SMD IC, the test point cannot be placed in the SMD IC silk screen. The diameter of the test point is equal to or greater than 1.8mm to facilitate online tester testing.

If the pad spacing is less than 0.4mm, white oil must be laid to reduce continuous welding during over-peak.

Both ends and ends of the chip components should be designed with lead tin. The width of lead tin is recommended to use 0.5mm wire, and the length is generally 2 or 3mm.

If there is a hand soldering component on the single panel, the tin trough should be opened, the direction is opposite to the direction of the tin, the width depends on the size of the hole from 0.3MM to 1.0MM; (50-70% of the aperture);

The distance and size of the conductive rubber buttons should be consistent with the actual size of the conductive rubber buttons. The PCB board connected to this should be designed as a gold finger, and the corresponding gold plating thickness should be specified.

The size and pitch of the pad should be the same as the size of the chip component (1: 1).

For solder joints with the distance between the pads (the number of pads greater than 4) on the same straight line less than 0.4mm, on the basis of adding white oil, the long side of the component and the direction of the wave peak are as parallel as possible, then the pad Add an empty pad or enlarge the pad at the end in order to eat the trailing solder and reduce the continuous soldering.