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CAPABILITY

Our rigid PCB products cover 1-30 layers and are widely used in industrial control, power supply, national defense, medical, automotive, security, computer and other fields. The main rigid printed circuit board product types include single-sided PCB, double-sided PCB, high-end multilayer PCB, HDI PCB, high-frequency PCB(Rogers PCB, Taconic PCB, Arlon PCB), Hybrid PCB, metal core PCB, rigid-flex PCB etc., and our special PCB technology that can process include thick copper, resin plugged holes, control depth routing, countersink, countersunk, press fit holes, PCB edge plating, blind & buried vias, half plated holes etc. We can also design and develop new processes according to customer product needs. To meet the personalized process and quality requirements of customers' special pcb products.

Rigid PCB Capability

Project	Specification	Factory Assessment
Layers Count	Min-Max	1–30L
Warp & Twist		<=0.75%
Panel Size	Max	5101500MM(1 & 2L) 550650MM(>=4L)
Material type		FR4，Aluminium base,High TG,Halogen-free,PTFE,Ceramic
Double Layer	Copper Foil Thickness	(0.5 1 2 3 4 5 6)oz
Double Layer	Minimum Core Thickness	0.4mm
Multilayer	Copper Foil Thickness(InnerLayers)	(0.5 1 23 4 5..10)oz
	Copper Foil Thickness(OuterLayers)	(0.5 1 2 3 4 5 6..12)oz
	Minimum Core Thickness	0.1mm
	Minimum B-stage Thickness	2.0mil
Board Thickness	Minimum Board Thickness(Double-Sided)	0.4mm
	Minimum Board Thickness(MultilayersBoard)	0.4mm
	Maximum Board Thickness(Double-Sided)	3.2mm
	Maximum Board Thickness(MultilayersBoard)	5.0mm
Artwork—Inner layer(Signal layer)	Minimum Line width	3mil
Artwork—Inner layer(Signal layer)	Minimum space between circuits	3mil
Mechanical Drill(Through-holes)	Minimum Via Diameter (After Plating)	0.15mm
Through holes	Maximum aspect ratio	12:1
Electroless Nickel / Immersion Gold	Minimum / Maximum Nickel Thickness	100-200u"
Electroless Nickel / Immersion Gold	Minimum / Maximum Gold thickness	1-5u"
Immersion Silver (over copper)	Minimum / Maximum Silver thickness	0.1um-0.5um
HAL	Minimum / Maximum Solder thickness	1um-40um
OSP	Minimum / Maximum Coating thickness	0.2um-0.6um
Hard gold plated	Maximum Gold thickness	50u"
Outer Layer Imaging	Artwork registration tolerance	2mil
Artwork—Outer layer	Min line width	3mil
	Min line spacing	3mil
	Min BGA PAD	0.2mm
Drilling	Accuracy of hole position	±3mil
	Space between hole edge	12mil
	Line to hole size	7mil(<8L); 8mil(>8L)
	Min diameter of slot hole size	0.45mm
	Tolerance of PTH hole size	±3mil
Solder Mask	Minimum opening path on pad (one side)	3mil
	Tolerance of exposure registration	±2mil
	Minimum solder mask Thickness (Above Trace)	10um
Solder Mask	Minimum width of solder mask bridge	Copper≤1OZ: 5mil Copper≥1OZ: 8mil
Solder Mask	Color of Solder Mask	green blue white red black
Legend (Silkscreen)	Minimum width of legend	0.15mm
Legend (Silkscreen)	Minimum height of legend	0.7mm
Routing	Min space between routing edge to copper surface	0.25mm
Routing	Tolerance of routing slot	±0.1mm
V-cut	V-cut angle	20 30 45 60
	Min space between V-cut edge to V-cut edge	3mm
	Min space between V-cut edge to board edge	3mm
Gold Finger	Beveling angle	30 45 60
Gold Finger	Tolerance of beveling depth	±0.15mm
Impedance Control	Tolerance	±10%
Impedance Control	Space between probes	0.15mm