Any Pcb Fab That Can Do Clear Mask Pcb?
Available standard laminate thickness are listed in ANSI/IPC-D-275. It is not to be confused with Printed Circuit Corporation.
Thermal expansion is a vital consideration particularly with ball grid array and bare die technologies, and glass fiber provides the most effective dimensional stability. The fabric or fiber material used, resin material, and the material to resin ratio decide the laminate's kind designation (FR-4, CEM-1, G-10, etc.) and due to this fact the traits of the laminate produced. Laminates are manufactured by curing underneath pressure and temperature layers of fabric or paper with thermoset resin to form an integral last piece of uniform thickness.
PTFE, ceramic filled - expensive, low dielectric loss, for high frequency purposes. Varying ceramics/PTFE ratio allows adjusting dielectric constant and thermal expansion. The circuitboard substrates are usually dielectric composite supplies. The composites include a matrix and a reinforcement , and in some instances a filler is added to the resin (e.g. ceramics; titanate ceramics can be utilized to extend the dielectric constant). There are quite a couple of different dielectrics that can be chosen to offer completely different insulating values relying on the requirements of the circuit.
Some of these dielectrics are polytetrafluoroethylene , FR-4, FR-1, CEM-1 or CEM-three. Well known pre-preg supplies used within the PCB trade are FR-2 , FR-3 , FR-four , FR-5 , FR-6 , G-10 , CEM-1 , CEM-2 , CEM-three (non-woven glass and epoxy), CEM-4 , CEM-5 .
The dimension could be as much as four by eight ft (1.2 by 2.4 m) in width and size. Varying cloth weaves , fabric thickness, and resin share are used to attain the desired final thickness and dielectric traits.