PCB Fabrication

Printed circuit board (PCB) design uses brand-new technology design engineers present new challenges and opportunities

by:A-TECH      2021-03-27
The use of new technologies, such as BGA and CSP, for printed circuit board (PCB) design, presents new challenges and opportunities for design engineers. Although many people in the industry believe that ball grid array (BGA) and chip scale packaging (CSP) are still emerging technologies, some leading electronics manufacturers have introduced or modified one or two variants of CSP. BGA packaging has been developed to be fully compatible with the current welding assembly technology. The CSP or fine-pitch BGA has a gate pitch of 0.5, 0.65, and 0.80mm. Compared with this, a plastic or ceramic BGA has a relatively wide contact pitch (1.50, 1.27, 1.0mm). Both coarse and fine pitch BGAs are less susceptible to damage than fine pitch lead package ICs. The BGA standard allows selective removal of contact points to meet specific I/O requirements. When establishing that the BGA has established the contact point layout and pin distribution, the package developer must consider the chip design and the size and shape of the circuit die. The other problem to be encountered when planning the pinout is the orientation of the circuit chip. When suppliers use chip-on-board technology, they usually adopt a form with the circuit chip facing up.
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