Final Finish Comparison
It is a 2-layer process by layering nickel on top of copper first than adding a finishing layer of gold. PCB finishes using OSP are popular as environmentally sound, “green” PCB remedies which are lead free and provide extremely flat mounting surfaces for parts. Additionally, OSP is often thought of a brief end and never a everlasting, last finish, although in an optimum environment it might have extended life. Soldermask is a polymer materials that gives a protective coating for copper traces and prevents solder from making unwanted connections and short circuits.
This is a material that may trigger the solder joints to be weak and fail often as they come out of the soldering operations. Unfortunately, there is no fix for this downside and the entire assemblies need to be discarded. Another drawback with ENIG is that the layer of gold that's utilized is so skinny that it doesn't present long term corrosion protection and the ensuing boards haven't any shelf life. This is the most effective floor finishing used today because it allows a flat floor with glorious solderability despite a better value. When utilized the gold really dissolves into the solder in order that it received’t tarnish or oxidize.
Its distinguishing attribute is that it uses an electroless nickel and a thin layer of immersion gold to protect the PCB from oxidation. During PCB design, considerable attention is given to the PCB format and the specification of materials, which can embrace the substrate, laminate and core for your board’s layer stackup. These choices are common to all good design for manufacturing utilization; however, the numerous choices for PCB floor end are too often not given sufficient consideration. Yet, the floor finish is a vital consideration that impacts PCB meeting and your board’s reliability by defending copper traces and strengthening solder connections. Moreover, there are several forms of PCB surface finishes, as listed below.
As you might guess from P standing for preservative, OSP preserves the copper surfaces of plates from oxidation by means of a very thin protective layer of material. After a cleansing process, a water based mostly compound selectively bonds to the copper after which protects the copper pad earlier than soldering. However, the draw back of this end materials is that the oxidation safety isn't absolute.
In truth, the printed foil laminate that is manufactured from Cu is also known as the copper-clad plate (PCB-Cu). However, PCB-Cu is inclined to undergo from surface oxidation or electrochemical corrosion. Usually, certain surface treatment processes are at all times applied on the floor of PCB-Cu to boost its capacity for corrosion resistance.
The integrity of the lead and tin bonding of a PCB is compromised, mainly due to the usage of copper and palladium. The ENEPIG coating can be susceptible to fractures if not appropriately used, since the layers on top of the nickel plating may be quite brittle. Also, if the palladium layer is too thick, the performance and reliability of the solder are lowered. This means that you want a trusted supply for ENEPIG as selecting appropriate chemistry and maintaining the chemistry is key for high quality ENEPIG finish.
ENIG is considered one of the best lead-free end for nice pitch because of its flat surface, good solderability and good shelf live . The nickel layer serves as a barrier to the copper and is the surface to which elements are soldered. ENIG may be brittle and isn't really helpful for functions where shock or strong vibrations.
Careful dealing with of the boards is critical during meeting as acid from fingerprints may cause oxidation anyway. It also does not permit wave soldering for double-sided boards as a result of the thermal publicity may also trigger oxidation of the copper. There are nonetheless issues in terms of reliability with an ENEPIG end if a board shop does not maintain their chemistry.
The newest highest reliability necessities demand a excessive efficiency electroless nickel and immersion gold . The new IPC specification 4552B has refocused the business as regards to nickel corrosion. It might clearly be shown that HP ENIG is able to cope the demands of this spec. Finally, the amorphous structure as well as the electrochemically extra noble behavior of the HP Ni reveals it as the only option for publicity to corrosive media, both immersion Au baths and/or corrosive environment.
“Electroless” and “immersion” indicate that the nickel and gold should be deposited on the copper without the usage of electricity. The challenge is that this finish is utilized with two complicated chemical baths.