I anticipate that principal benefit of this form of development comes from the very thin dielectric layer. If you'll be able to't cut back this to an analogous thickness, the DIY route seems implausible.

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Solder joints with low void content material are important for long term performance and reliability. Two kinds of MCPCB substrates, four totally different solder pastes and one sort of LED ceramic package have been evaluated in this study to develop a low voiding meeting course of. Results of the research and suggestions for achieving low voiding are introduced.