PCB Blog

Making a PCB board is not a simple process to complete the board, just drill a hole and put the components on it. PCB production is not difficult, the difficulty lies in the troubleshooting after the completion of the production. Whether it is an individual enthusiast or an industry engineer, it is quite a headache for the PCB board to encounter problems during debugging, just like a programmer encounters a BUG.

The PCB is short-circuited, the main reason is that the film line is scratched or there is garbage jam on the coated screen. The coated anti-plating layer is exposed to copper and the PCB is short circuited. The improvement is as follows introduced in the article.

Introduction about single-sided and double-sided Flexible PCB, there are different types of single-sided flexible pcb and double-sided flexible PCB in manufacturing, the articles will introduce them in details..

Warpage in the manufacture of printed circuit boards can cause inaccurate positioning of components; when the board is bent in SMT and THT, the components are not properly inserted, which will bring difficulties to assembly and installation work.

In recent years, flexible circuit boards (FPC) have become one of the fastest growing sub-sectors in the printed circuit board industry. What issues should be paid attention to when soldering flexible boards?

BGA is a packaging method. The full name of BGA is Ball Grid Array. With the continuous development of electronic technology in the 1990s, the IC processing speed has also continued to increase. The number of I / O pins on integrated circuit chips has increased. Continuous improvement, all levels of elements clearly put forward higher regulations on IC packaging, and in order to consider the development of electronic equipment towards miniaturization and precision, BGA packaging has been released and put into production.

PCB board soldering technology has made great progress in the electronics industry in recent years, and it can be noted that a very obvious trend is the problem of reflow soldering technology. The quality of PCB circuit board soldering is also a matter of close attention of major electronic manufacturers. Let's take a look at the three major factors that constitute PCB board soldering defects!

PCB prototype charges are generally based on engineering fee + pcb board fee + e-test fee + film fee. Generally, there is no e-test fee for PCB prototype. Film fees depend on the PCB factory's process. Some factories do positive film technology and do not charge film fees. Some negative film factories charge film fees.

This article mainly discusses how to optimize the size of the panel by controlling these influencing factors under the premise of meeting the PCB and PCB assembly process requirements in the process of panel design, so that it can produce high plate utilization when forming PCB production panels Rate and suitable production panel size, so as to obtain a lower PCB quotation.

The production process of printed circuit board is generally divided into three types: single-sided, double-sided and multilayer PCB. The names of factories with different production processes are different, but the principle of the process is the same!

In the high-speed PCB design process, special components refer to the key components of the high-frequency part, the core components in the circuit, the components that are susceptible to interference, the high-voltage components, the components with large heat, and some components. For heterosexual components, you need to carefully analyze the location of these special components to make the layout meet the circuit function and production requirements. Incorrect placement of them will cause circuit compatibility issues, signal integrity issues, and lead to PCB design failures.

Surface Mounting Technolegy (SMT) is a new generation of electronic PCB assembly technology that will use traditional electronic components. The device is compressed into a device with a volume of only a few dozens, thereby achieving high density, high reliability, miniaturization and low cost of electronic product PCB assembly. This miniaturized component is called: SMY device (or SMC, chip device). Assemble components for printing. The process on (or other substrate) is called the SMT process. The related assembly equipment is called SMT equipment.

In the process of PCB board manufacturing, in order to ensure the production quality of PCB boards, PCB manufacturers usually use a variety of detection methods for different PCB defects in the production process, include: 1. Manual visual inspection of PCB board. 2. Online test of PCB board. 3. PCB board function test. 4. Automatic optical Inspection(AOI). 5. Automatic X-ray inspection. 6. Laser detection system. 7. Size detection.

The small holes on the PCB are vias, used to connect electrical signals from one layer to another.The holes on the pcb board can be divided into three types, screw holes, conductive holes, plug-in holes. The screw holes are used for fixing. Conductive holes (also called over-electric holes) are used to conduct electricity just like wires. The plug-in hole is of course used to insert various parts, such as diodes, transistors, capacitors, inductors and so on.

Various factors affecting the price of a PCB board, include: 1. Different materials used in PCB cause price diversity. 2. Different PCB surface treatments cause price diversity. 3. The price diversity caused by the difficulty of PCB itself. 4. Different copper foil thickness causes price diversity. 5. Customer's quality acceptance standard. 6. Mold fee and test fixture. 7. The price difference caused by different payment methods.