Brown process for multilayer PCB manufacturing
After AOI inspection the inner layer cores are chemically treated to improve adhesion of the copper surface which are ready for lamination process. The purpose of brown process is to increase the roughness of copper on inner layer core, this will be helpful to increase the adhesion strength between each layers in the process of lamination.
A-TECH Circuits uses organic chemistry that leaves the copper a dark brown. Other types of
chemistry or mechanical methods can be used and colors vary widely.
Share:
-
Brown process for multilayer PCB manufacturing
-
Automatic copper plated(PTH) - PCB fabrication process
-
Lamination process of multilayer PCB
-
Drill process - China PCB manufacturing
-
Inner layer lay up before lamination - multilayer PCB fabrication
-
Printed Circuit Board Manufacturing丨Inner Layer Image Process
-
AOI for inner layer image - multilayer PCB manufacturing
-
Online AOI For Multi-layer PCB Inner Layer After Etching