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impedance pcb edge plating process best price top supplier A-TECH

impedance pcb edge plating process best price top supplier A-TECH

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
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Pieces
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Enterprise Strength
  • A-TECH has established a complete service system to provide professional pre-sales, sales, and after-sales services for customers.
Product Comparison
PCB Manufacturing is a truly cost-effective product. It is processed in strict accordance with relevant industry standards and is up to the national quality control standards. The quality is guaranteed and the price is really favorable.PCB Manufacturing produced by A-TECH stands out among many products in the same category. And the specific advantages are as follows.
Company Advantages
1. Before A-TECH pcb edge plating process leaves a warehouse, every aspect will be analyzed and inspected to make sure that the product is perfect in every way.
2. countersink pcb has received much attention since is development due to its pcb edge plating process performance.
3. A sincere attitude to producing countersink pcb is kept in each A-TECH staff's mind.
4. A-TECH CIRCUITS Co., Ltd. is very famous for its strict quality assurance.


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII





A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. A-TECH CIRCUITS Co., Ltd. has long been focused on the R&D and manufacture of countersink pcb .
2. A-TECH CIRCUITS Co., Ltd.'s current production and processing level for blind vias pcb exceeds the Chinese general standard.
3. Leading the pcb edge plating process industry has always been the goal of A-TECH. Inquire now! A-TECH CIRCUITS Co., Ltd. has always pursued excellence and professionalism in the via in pad pcb field. Inquire now!
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