HDI PCB

HDI PCB

Layer
6
Material
FR4(Tg150)
Min Order Quantity
No
Production Lead Time
8-18 Working Days
Supply Capacity
3000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
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HDI PCB, the full name is High Density Interconnect PCB, it requires much higher wiring density with finer trace and spacing, smaller vias and higher connection pad density. Blind and buried vias’ design is one of their marked feature. HDI PCB are widely used for Cell phone, tablet computer, digital camera, GPS, LCD module and other different area.



The benefits of HDI PCB

  

● Reduce the cost
● Better reliability
● Increase the wiring density
● Increase design efficiency
● Can improve the thermal properties
● In favor of the use of advanced packaging technology
● Has better electrical performance and signal correctness
● Can improve the radio frequency interference, electromagnetic interference and electrostatic discharge



A-TECH CIRCUITS provides HDI PCB manufacturing services to worldwide customers in the high end automotive industry, medical electronic device industry, mobile, computing and defense industry.

Currently the advanced HDI technology we used include: "Direct Laser Drill"(DLD) is drilling of copper layer by direct CO2 laser irradiation, compare to additional laser drilling with conformal mask, the copper direct laser drilling is capable of providing higher accuracy, better hole quality and better efficiency for HDI projects. "Copper Filled" for special stack microvia, "Laser Direct Imaging"(LDI) is specifically designed for fine line technology, to eliminate dimensional stability problem of artwork caused by environmental and material issues.



General Specification for HDI PCB in A-TECH
Layer Count4-20Layers
Type of stack up1+N+1, 2+N+2, 3+N+3
Material AvailableFR4, High Tg FR4, Halogen Free FR4
Board thickness0.4-3.2mm
Finished copper thickness1-6oz
Finished copper thickness1/3oz – 2oz
Min trace width/spacing3/3mil
Min through hole0.2mm
Min blind via0.1mm
Types of blind viaStack microvia, Stagger microvia
Surface treatmentImmersion Gold, Selective ENIG + OSP(BGA area)



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