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Multilayer PCB

Multilayer PCB

Layer
8
Material
FR4(Tg170)
Min Order Quantity
No
Production Lead Time
4-15 Working Days
Supply Capacity
20000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
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Pieces
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Multilayer PCB has more than two conductive copper layers which mainly consist of inner layer cores, prepreg layers and copper foils and they’re melted together through heat and pressure. Lamination process is one of the key to control good quality of multilayer PCB, this process requires specific heating and pressure for specific periods of time based on materials used to ensure the PCB board is made properly.

The multilayer PCB is the development of the double sided PCB with increasing complexity and density of components, they allowed the designers to produce highly complex and compact circuits and further development of blind and buried via hole technology has pushed these limits even further. With the requirements of higher precision in various applications, the demands of multilayer PCB keep increasing continuously in recent years. The typical applications of multilayer printed circuit boards include Computers, Data storage, Cell phone transmission, GPS technology, satellite systems and so on.



The benefits of multilayer PCB

  

● Increased flexibility
● Higher assembly density
● Smaller size(considerable savings on space)
● Easier incorporation controlled impedance features
● Reduces the need for interconnection wiring harnesses(Reduces overall weight)



A-TECH is an experienced multilayer PCB manufacturer which own complete multilayer PCB manufacturing process in house from inner layer, vacuum lamination to surface finishes, it brings us more advantages in the competition of global market shares for multilayer printed circuit boards on quality, price and lead time. Currently the proportion of multilayer PCB we manufactured is more than 65%.



General Specification for multilayer PCB in A-TECH
Layer Count4~30 Layers
Material AvailableFR4, High Tg FR4, PI, Teflon, Rogers.
Max board size550*650mm
Board thickness0.4-5.0mm
Finished copper thickness0.5-6oz
Min trace width/spacing3/3mil
Min hole size0.15mm
Colour of Solder MaskGreen, Blue, White, Black, Yellow, Red.
Colour of SilkscreenWhite, Black, Yellow.
Surface treatmentHASL, HAL(Lead free), OSP, Gold Plating, Immersion Gold/Tin/Silver, Carbon, Peelable Mask.



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