Home  > PCB MANUFACTURING  > Printed Circuit Boards  >  Rigid flex PCB
Rigid flex PCB

Rigid flex PCB

Layer
8
Material
FR4(Tg170) + PI
Min Order Quantity
No
Production Lead Time
8-20 Working Days
Supply Capacity
2000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Captcha

Loading verification code...

Please complete verification first


Rigid flex PCB, as the name suggests, it’s combined with rigid PCB and flex PCB, and the rigid circuits are connected with single or multiple flex circuits through plated through holes. Coverlay’s are applied to the flexible copper conductor and liquid photo imagable solder resist applied to the rigid PCB areas.

Rigid flex PCB is different with the case of flex PCB with FR4 stiffeners, basically no any conductors or plated through holes(PTH) on FR4 stiffener but only be used with the purpose of increasing strength for specified areas, for rigid part of rigid flex PCB, there are conductive circuit patterns and plated through holes extend through both rigid and flex layers.



The benefits of rigid flex PCBs

● Dynamic and mechanical stability
● 3-dimensional freedom of design
● Simplified installation
● Space saving
● Maintenance of uniform electrical characteristics



The application of rigid flex PCBs

● Consumer Electronics
● Industrial Controls
● Medical
● Military
● Optoelectronics
● Semiconductor
● Testing & Measurements




Stackup of 8 layers Rigid-flex PCB

With several years’ experience in manufacturing rigid flex PCBs and continuously investing to use state-of-the-art equipments, A-TECH own mature technology and excellent quality control system to ensure high level quality of products. Currently we’re able to fabricate various rigid flex PCB from double sided to multi layers with complex constructions.



General specification for rigid flex PCB in A-TECH
Layer Count2-16 layers
Board thickness0.6-3.0mm
Base polyimide film thickness0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ).
Copper thickness1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
Copper thickness(rigid part)1/2oz (18µ), 1oz (35µ), 2oz (70µ), 3oz (105µ)
StiffenersPolyimide, FR4, FR4(High Tg)
Min trace width/spacing3/3mil(0.075/0.075mm)
Min drill size0.2mm
Surface treatmentImmersion Gold/Tin, Gold/Tin Plating, OSP



Product Message

Chat Online 编辑模式下无法使用
Chat Online inputting...