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hybrid thick copper pcb control top supplier A-TECH

hybrid thick copper pcb control top supplier A-TECH

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
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Pieces
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Company Advantages
1. Digital molding technique and meta-mechanical analysis are used in the development of A-TECH impedance pcb by the R&D team. The team strives to create a product with high precision which suits most people's foot arch. The product has the performance of great stability
2. By consistently developing the performance of thick copper pcb , A-TECH has got wide recognition for its high quality products at home and abroad. Its solder mask can be offered with green, blue, white, black, yellow, and red colors
3. thick copper pcb has received much attention since is development due to its impedance pcb performance. It is 100% produced in accordance with IPC-6012 & IPC-A-600F standards


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII





A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. A-TECH CIRCUITS Co., Ltd. is widely praised for high quality and impedance pcb for thick copper pcb .
2. We are continually looking to improve the efficiency of our entire supply chain. We aim to maximize equipment efficiency while ensuring we maintain high standards of product quality.
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