loading

Via In Pad

Via In Pad
  • Via In Pad

Via In Pad

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Comparison
A-TECH is certified by various qualifications. We have advanced production technology and great production capability. PCB Manufacturing has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.Compared with other same kind of products in the market, A-TECH's PCB Manufacturing is equipped with the following outstanding advantages.
Application Scope
A-TECH's PCB Assembly is mainly used in the following aspects.A-TECH is committed to providing customers with high-quality PCB Manufacturing as well as one-stop, comprehensive and efficient solutions.
Company Advantages
1. A-TECH thick copper pcb is available in numerous design styles.
2. The product has stable operating pressure. During the operation, the pump depletion phenomenon is eliminated to avoid dry friction or damage to sealing.
3. Many of our customers say it will not get pilling or undergo color fading even they wash it many times.
4. One of the best reasons to use this product is because it enables people to make their own space out of nothing.


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII





A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. With talented sales team and rich export experience, A-TECH CIRCUITS Co., Ltd. sells thick copper pcb to many countries.
2. Our skilled workers are rigorously trained before starting formal manufacturing work.
3. A-TECH CIRCUITS Co., Ltd. aims to improve the user experience and spread the brand reputation by word-of-mouth. Call! A-TECH CIRCUITS Co., Ltd. is well prepared to deal with all difficulties and challenges. Call! With rich experience and mature technical products, A-TECH CIRCUITS Co., Ltd. enjoys a high reputation in the domestic and foreign markets. A-TECH CIRCUITS Co., Ltd. can supply the high cost-performance ratio for our customers. Call!
Favorable rate
100%
Buyer impression
This product has no buyer impression
  • All reviews(0)
  • Praise (0)
  • Average (0)
  • Bad review (0)
Product Message
社媒暂无评论
Chat Online 编辑模式下无法使用
Chat Online inputting...
Please hold on and we will get back to you soon