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A-TECH Wholesale pcb copper thickness best price at discount

A-TECH Wholesale pcb copper thickness best price at discount

Type of Blind Vias
Laser Drill & Mechanical Drill
Min Laser drill blind Vias
0.1mm
Min Mechanical drill blind vias
0.15mm
Min Buried Vias
0.15mm
Min Order Quantity
No
Production Lead Time
6-20 Working Days
Supply Capacity
3000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
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Quantity Needed:
Pieces
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Company Advantages
1. A-TECH press fit pins pcb is manufactured with accuracy in specifications. It is widely used in different electronics industries, such as telecommunication and consumer electronics
2. The robust sale growth indicates the bright future of the product. Its solder mask can be offered with green, blue, white, black, yellow, and red colors
3. As for the maintenance of this product, it is not necessary to wash with water. Users only need to wipe with a dry cloth. It has low water absorptivity in the damp environment
4. The product has a long service life. Its fully shielded design helps to avoid leakage problems and thus better protects its components from damage. It is extremely popular in the markets of Europe, North America, and Asia


PCB with Blind and Buried Vias

Basically the blind and buried vias are popular to be designed on high density PCBs due to the limit of small space, the blind and buried vias can only pass through necessary layers and more surface area become available for components, they have the ability to meet the density constraints of line and pads on a typical design without increasing the layer count or board size and reduce the PCB aspect ratio for convenient production.


Blind Vias

Blind via is a copper plated hole that connects only one outer layer to one or more inner layers, it never goes all the way through a circuit board but only visible on one side of circuit boards. The blind via can be laser or mechanically drilled based on the detailed via hole size and layer stackup.


Buried Vias

Buried Via is a copper plated hole that connects two or more inner layers without contacting the outer layers, as the name suggests, it’s buried inside, so it’s not visible from the outer layer of PCB. Buried via has no impact to any trace or surface mount component on the top or bottom layers, trace or SMD pad can be placed directly over the buried via.

A-TECH CIRCUITS has capacity to build both of blind via and buried via with different demands, We’ll use laser drill for the blind vias with size smaller than 150um and use mechanical drill for the blind via size larger than 150um, the technology of blind via we can achieve include via in pad, stacked via and staggered via. The minimum size of buried via normally need to be 150um and they’ll be plugged with resin to avoid prepreg flow into buried via which might affect the connection with adjacent layers.




Company Features
1. We continually reinvest in our machinery and personnel to ensure our customers are treated to the best equipment and highly trained personnel – which is key to the success of all our projects.
2. High quality customer service of A-TECH is highly commented by customers. Ask!
The persistent team of A-TECH has also been working hardly on the design of pcb copper thickness. This product has the advantage of excellent sealability
A-TECH pcb copper thickness is creatively designed to help customers break into the fast-growing market. It is able to undergo extremely high and cold temperatures
Our pcb copper thickness has its own style than other products thanks to the support of our excellent staff. This product is distinguished by its sound and heat insulation
pcb copper thickness achieves excellent levels of detail. This product is distinguished by its sound and heat insulation
pcb copper thickness achieves to a high level in terms of quality and safety. It can significantly help save on construction costs
This product will retain its clean appearance. The dust and other residues are not prone to build upon the surface of fabrics over time. This product features a stable structure, which is not easy to collapse
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