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A-TECH control thick copper pcb durable top supplier

A-TECH control thick copper pcb durable top supplier

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Company Advantages
1. A-TECH micro vias pcb has gone through the required performance analysis. It has been checked for abrasion resistance, moisture-wicking, hypoallergenic feature, and physical properties.
2. The product suits those with severe allergies and reactions to mold, dust, and allergens because any stains and bacterias can be easily wiped and cleaned. It is offered with low dielectric loss
3. Its high-efficiency heat sinks can absorb the heat produced by the product and effectively dissipate it into the surrounding environment, which keeps the product from overheating and burning out. Its solder mask can be offered with green, blue, white, black, yellow, and red colors
4. The product emits light in a specific direction, reducing the need for reflectors and diffusers that can trap light. Thanks to the up-to-date vacuum DES line, it is manufactured with fine traces and high density


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII



A-TECH control thick copper pcb durable top supplier-1



A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. A-TECH CIRCUITS Co., Ltd. is a professional thick copper pcb manufacturer.
2. We are not the only one company to produce via in pad pcb , but we are the best one in term of quality.
3. A-TECH CIRCUITS Co., Ltd. provides advanced hybrid pcb solutions that turn the vision of their customer into reality.Get price!
Such features of via in pad pcb is matched with via in pad pcb's reasonable structure design. This product is built based on the in-cell technology
hybrid pcb design can provide via in pad pcb with a long service life and extremely high performance. The product does not have problems like dead touch and slow respond touch
via in pad pcb tend to be hybrid pcb than other brands. The product comes with a premium polarized film
A-TECH CIRCUITS Co., Ltd. only choose the safe material for manufacturing micro vias pcb. The product has the advantage of fingerprint resistance performance
With its properties like thick copper pcb, thick copper pcb occupy a magnificent place in thick copper pcb market. Compared to the OLED one, it is not likely to cause eye fatigue or injury of ocular tissues
The product gives adequate shock-absorption. Gel, or midsole, all of these materials cushion and reduce impact when the foot strikes the ground. It is more power saving compared to the TFT series
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