What is the difference between lead-free tin spraying and lead tin spraying on PCB circuit boards?

With the continuous development of the electronics industry, the technical level of PCB is also rising. Common surface treatment processes include tin spraying, immersion gold, gold plating, OSP, etc.; among them, tin spraying is divided into lead-free tin spraying and lead-free tin spraying. So, what is the difference between lead-free tin spraying and lead tin spraying on PCB circuit boards? 1. Lead-free tin spraying is an environmentally friendly process, does not contain harmful substances 'leadThe temperature is around 260-270 degrees. 2. Lead spraying is not an environmentally friendly process, and it contains harmful substances 'leadAround 245-255 degrees. 3. From the surface of tin, lead-tin is brighter, and lead-free tin is dull; the wettability of lead-free board is a bit worse than that of leaded board. 4. The lead content of lead-free tin does not exceed 0.5, and the lead content of leaded tin reaches 37. 5. Lead will increase the activity of the tin wire during the soldering process, and the leaded tin wire is better than the lead-free tin wire; but lead Toxic, long-term use is not good for the human body. Lead-free tin has a higher melting point than lead tin, and the solder joints will be much stronger. 6. In the surface treatment of pcb boards, the price of lead-free tin spraying and lead tin spraying is usually the same, there is no difference. The above is the difference between lead-free tin spraying and lead tin spraying on PCB circuit boards. I hope to help everyone.