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routing via in pad pcb thick copper hot-sale for sale

Routing via in pad pcb thick copper hot-sale for sale

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
Get Latest Price
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Quantity Needed:
Pieces
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Product Information of routing via in pad pcb thick copper hot-sale for sale
Company Advantages
1. A-TECH press fit pins pcb is developed professionally by the in-house R&D team who strives to provide a specific heat dissipation solution for our customers. Its solder mask can be offered with green, blue, white, black, yellow, and red colors
2. The product is able to maximum satisfaction to the clients and is now widely used in the market. It is vacuum-sealed, which can greatly reduce the bulk of the overall cargo
3. The product is renowned for its sophisticated workmanship. All edges are finely rounded and the surface is handled to achieve desired smoothness. It can reduce the electrical signal loss and provides the highest efficiency
4. The product is highly resistant to rust. It has gone through corrosion-resistant treatments which greatly optimize its chemical properties. Its solderable surface is protected from the oxidation


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII



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A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. A-TECH CIRCUITS Co., Ltd. has gathered a wealth of professional design and manufacture expertise.
2. Following the trend of via in pad pcb has been always something A-TECH sticks to. Check now!
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