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routing thick copper pcb press durable for wholesale

Routing thick copper pcb press durable for wholesale

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
Get Latest Price
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Quantity Needed:
Pieces
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Product Information of routing thick copper pcb press durable for wholesale
Enterprise Strength
  • A-TECH firmly believes that only when we provide good after-sales service, will we become consumers' trusted partner. Therefore, we have a specialized professional customer service team to solve all kinds of problems for consumers.
Company Advantages
1. thick copper pcb is manufactured based on high-quality materials. Comfortable in touch feeling, it can bring a good wearing experience.
2. The product has a low surface roughness index. Its surface has been treated with grinding machining to eliminate any burrs and sags and crests.
3. The product has remarkable sealing performance. All its components and parts are finely soldered inside the housing.
4. A-TECH CIRCUITS Co., Ltd. has accumulated good management experience and formed good service concept.


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII



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A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. We have experience in manufacturing press fit pins pcb .
2. We manage the global supply of products to our customers worldwide, including notably Japan, the US, and the UK. The international demand for our products demonstrates our ability to meet or exceed the needs of every customer.
3. We are always here waiting for your feedback after buying our thick copper pcb . Ask! The service concept of micro vias pcb has been established in A-TECH CIRCUITS Co., Ltd.. Ask! A-TECH CIRCUITS Co., Ltd. can provide OEM service for customers. Ask!
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