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counter sink edge plating pcb press top supplier A-TECH

counter sink edge plating pcb press top supplier A-TECH

counter sink edge plating pcb press top supplier A-TECH

Max size of VIP
0.4mm
Design of VIP
In BGA or SMD Pads
Fabrication of VIP
Resin plugged and overplate to cap
Min Order Quantity
No
Production Lead Time
7-18 Working Days
Supply Capacity
5000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Application Scope
The Quick Turn PCB produced by A-TECH has a wide range of applications.While providing quality products, A-TECH is dedicated to providing personalized solutions for customers according to their needs and actual situations.
Enterprise Strength
  • A-TECH abides by the service attitude to be sincere, patient and efficient. We always focus on customers to provide professional and comprehensive services.
Company Advantages
1. The traditional structure of edge plating pcb is greatly improved by A-TECH CIRCUITS Co., Ltd..
2. Our dedicated and skilled quality controllers carefully inspect the product at every step of production in order to ensure that its quality remains exceptional without any defect.
3. A-TECH CIRCUITS Co., Ltd. keeps continually researching and developing better edge plating pcb with higher performance.


Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.



The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.



The Via In Pad technology is defined in IPC standard with IPC-4761 VII





A-TECH manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.




Company Features
1. A-TECH CIRCUITS Co., Ltd. provides high quality edge plating pcb with advanced technology.
2. A-TECH CIRCUITS Co., Ltd. owns production and processing base mainly for the completed impedance control pcb project.
3. A-TECH CIRCUITS Co., Ltd. sincerely invites your visit to our factory. Inquire! A-TECH CIRCUITS Co., Ltd. will, as always, adhere to the policy of buried vias pcb . Inquire!
Favorable rate
100%
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