What are the ways to dissipate heat from the circuit board? -
What are the ways to dissipate heat from the circuit board? Release time: 2017-12-13 0 Circuit board heat dissipation method: 1. High heat-generating components plus heat sink, heat conduction plate 2. Heat dissipation through the PCB board itself 3. Use a reasonable wiring design to achieve heat dissipation 4. For the use of free convection air cooling It is best to arrange integrated circuits (or other devices) vertically or horizontally. 5. The devices on the same printed board should be arranged as far as possible according to their calorific value and degree of heat dissipation. Devices with low calorific value or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed The uppermost flow of the cooling airflow (at the entrance), and the devices with large heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed at the lowermost part of the cooling airflow. 6. In the horizontal direction, high-power devices are placed as close to the edge of the printed board as possible to shorten the heat transfer path; in the vertical direction, high-power devices are placed as close to the top of the printed board as possible to reduce the temperature of other devices when these devices are working. Impact. 7. Devices that are more sensitive to temperature are best placed in the lowest temperature area (such as the bottom of the device). Never place them directly above the heating device. It is best to arrange multiple devices in a staggered horizontal plane.