Substrate cleaning skills

by:A-TECH      2021-03-26
The substrate needs to be cleaned after a certain period of time. There are many cleaning methods, but the most widely used are the following three methods. You can choose according to your personal needs. The first is dry cleaning    with base oil, fingerprints and other organic pollutants to remove the first chemical cleaning liquid on the copper surface. In order to prevent the acidic solution, then with the original copper substrate on the oxide layer, the copper oxide protective layer, and finally in the micro-etching process to remove the dry film with excellent adhesion properties, surface roughening.   Chemical cleaning to remove copper foil, low advantage (1-1.5μm), the substrate itself is not subject to mechanical stress, thin plate processing is easier to operate than other methods. However, chemical treatment can monitor and adjust the solution to address the change in chemical composition of waste that needs to increase disposal costs. Those who resist engaged in the manufacture of dry film dry film to achieve the best surface for testing and research, with the previous 1) 3) larger way to cope with the board, paste the application of dry etching and printing to handle the width of the graphic plating line And spacing, no matter which cleaning method often has a success rate of 100%, if other methods, the width of the line with a pumice processing machine is 90mm, and the metal plate is drawn, the success rate of falling down 90%, the most serious drop to 60%. The second type is mechanical cleaning    mechanical cleaning machine, cleaning the brush plate. The brush driver is divided into two types: abrasive brush roller brush trigger and trigger pumice.  ① Abrasive brush roller brush plate machine    Abrasive brush roller brush plate assembly machine usually has two types of compression brushes, bristles. Compressed brushes are bound to be very fine-grained silicon carbide or aluminum oxide abrasive nylon, and then this fiber nylon or silk pillow is cured and cut into pieces, and installed on the core of the brush roller. The bristles are made of silicon carbide abrasives and a diameter of 0.6 mm, nylon series approximately the nature of the brush body. Different abrasive particle sizes are used for the purpose of brushing the size of the burr drill 320 and the purpose of sticking dry brushing after the substrate treatment 500 months ago. The purpose is different, generally 180 mesh and 240. Two advantages and disadvantages of brushing. The size of the compressed abrasive brush is very small. The surface of the electric brush pressure plate is brushed with a roller, and the brushed copper surface is uniform. The inner layer is mainly used for plywood substrate cleaning. The disadvantage is that the smaller and easy-to-use nylon RIP has a short lifespan. The main advantages of the brush type are the wear resistance and long service life of nylon, which is about ten times that of a compression brush, but the brush should not be used to process the inner multilayer substrate. The substrate is thin, not only because the treatment effect is more ideal, But it can also cause curled substrates. When using the roller brush to trigger the process to avoid economic overheating and melting of nylon fibers, the board should continue to spray cooling and humidifying water.  ②Paint pumice slab machine      At home and abroad for many years, most of them are abrasive brush roller brushing machines. Studies have shown that some shortcomings of this type of brushing and surface cleaning machine, such as the direction, is that the surface scratches are based on the grooves of the ground, and sometimes the edge of the ragged hole forms an oval hole, and the height The shape of the brush, the abrasive brush wear caused the uneven surface of the plate to be treated inconsistently. With the development of the electronics industry, modern circuit technology is getting thinner and thinner line width and spacing, triggering the development of grinding brushes or brushing long bristle processing boards, low-quality products, and pumice stone boarding. Answer: Pumice stone paint board machine into powder suspension steel surface with nylon brush, spray, especially in the following parts nylon brush, brush, machine cleaning, pumice brush liquid starch; C. Remove the pumice stone on the disk surface, scrub high pressure cleaning, wash your face The water is dry. Painted pumice trigger treatment board has the following advantages:   A. Abrasive nylon brush to clean the front panel. The effect of the pumice powder particles to remove dirt, revealing fresh, pure copper combination;   B. To form a complete sand mainly, roughly uniform There are no land-based sockets on the multi-peak surface;   C. Due to the loose nylon brush, the connection between the surface and the hole will not be damaged;   D. Due to the relatively soft, flexible nylon brush, electric brush Abrasion and tearing cause the uneven surface of the board;   E. Even if there is no grooved board, the exposure time of scattering is reduced, thereby improving the image resolution. The lack of pumice can easily damage the mechanical parts of the equipment. The third type is electrolytic cleaning, which is added to clean the surface of the substrate to dry delete the rule 1) 2) type of treatment, mechanical cleaning and painting the chromium passivation layer on the surface of the board substrate (antioxidant on the surface of the copper foil) has a good effect of pumice, but very Easy to scratch the surface, abrasive particles (such as alumina, silicon carbide, pumice powder) embedded in the body caused by, and flexible substrate, the size of the deformation of the multi-layer thin inner layer PCB substrate. The petrochemical cleaning effect is better, but the effect of removing the chromium passivation film is poor. The advantages of the electrolytic cleaning solution can not only better mechanical cleaning, chemical cleaning of pumice and mortar board substrates on the cleaning problem surface, but also produce a more uniform micro-rough surface of the substrate, significantly improving the surface dry film and improving adhesion On the surface of the substrate, it is very advantageous to produce high-density, thin wire patterns. The steps of electrolytic cleaning are as follows: feed→washing→cleaning→micro-electrolytic etching passivation→water washing→water washing→drying→output ①The main task is to remove copper oxide, fingerprints, stains and other organic materials on the surface substrate, chromium passivation electrolysis Clean.  ②The main task is to make the surface of the micro-etched copper foil form a larger micro-rough surface.
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