Company Advantages
1. Taking vippo pcb as its materials, hybrid pcb is characterized by buried vias pcb . It can reduce the electrical signal loss and provides the highest efficiency
2. When I used this product, it doesn't produce buzzing or flickering noises and it gives me the maximum eye comfort. - One of the customers said. It is 100% produced in accordance with IPC-6012 & IPC-A-600F standards
3. Superior performance and long service life make the product competitive. It stands out for its impact endurance performance
4. What distinguishes the product from others is the reliable quality, stable performance, and long service life. A smooth part is added on its PTH line to reduce the roughness of through hole
5. We continuously monitor and adjust the production process to ensure that the product quality meets the policy requirements of customers and the company. With a compact design, it is space-saving

PCB with Blind and Buried Vias

Basically the blind and buried vias are popular to be designed on high density PCBs due to the limit of small space, the blind and buried vias can only pass through necessary layers and more surface area become available for components, they have the ability to meet the density constraints of line and pads on a typical design without increasing the layer count or board size and reduce the PCB aspect ratio for convenient production.


Blind Vias

Blind via is a copper plated hole that connects only one outer layer to one or more inner layers, it never goes all the way through a circuit board but only visible on one side of circuit boards. The blind via can be laser or mechanically drilled based on the detailed via hole size and layer stackup.


Buried Vias

Buried Via is a copper plated hole that connects two or more inner layers without contacting the outer layers, as the name suggests, it’s buried inside, so it’s not visible from the outer layer of PCB. Buried via has no impact to any trace or surface mount component on the top or bottom layers, trace or SMD pad can be placed directly over the buried via.

A-TECH CIRCUITS has capacity to build both of blind via and buried via with different demands, We’ll use laser drill for the blind vias with size smaller than 150um and use mechanical drill for the blind via size larger than 150um, the technology of blind via we can achieve include via in pad, stacked via and staggered via. The minimum size of buried via normally need to be 150um and they’ll be plugged with resin to avoid prepreg flow into buried via which might affect the connection with adjacent layers.

Company Features
1. A-TECH CIRCUITS Co., Ltd. is a global high-end hybrid pcb manufacturing enterprise integrating R&D, production, sales and service.
2. A-TECH CIRCUITS Co., Ltd. adopts the internationally advanced quality management system.
3. A-TECH CIRCUITS Co., Ltd. aims to satisfy our customers with high quality and superior service. Check now!