China osp plating leveling factory at discount

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4 layers PCB with IPC CLASS3 acceptance standard

4 layers PCB with SHENGYI S1000-2

4 layers PCB with impedance control

4 layers PCB with ENIG finish

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HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB manufacturing.

HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).

The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.

The typical thickness of HAL(Lead Free) is 1-40um and the shelf life is 12 months.

The advantages of HAL(Lead Free) surface finish

● Good solderability / wettability
● RoHS Compliant
● Good reflow properties
● Large processing window is allowed
● Multiple thermal excursions
● Can be widely used

The disadvantages of HAL(Lead Free) surface finish

● Uneven surface
● Not suitable for PCBs with fine pitch
● Thermal shock
● Solder bridge
● Plugged or Reduced plated through holes

A-TECH have HAL(Lead Free) surface finish in house, It’s basically the highest proportion of finish used for circuit boards without fine pitch or high density layout. We don’t have any additional cost for HAL(Lead Free) surface finish.

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The law of heat conduction theory has been adopted in the developing of A-TECH enig pcb finish. It's specially made to allow the heat to be transferred from the higher temperature region to the lower temperature region.

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A-TECH enig pcb finish is designed by the designing department who aims to enlarge the heat radiating area by designing it into a groove shape. In this way, the heat transfer area is largened.

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The production of A-TECH osp plating consists of two parts, making processing such as extrusion, die casting, and stamping, as well as the deep process such as drilling, milling, and welding.

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During the production of A-TECH enig pcb finish, the accuracy of machining and grinding, surface roughness, concentricity, and verticality are all strictly scrutinized to guarantee high quality.

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In order to meet the standards of the heatsink industry, A-TECH osp plating has to go through a strict inspection process conducted by precise inspection equipment.

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The product is quality-assured as it has to be subjected to strict quality tests.

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A-TECH leveling osp plating factory at discount