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A-TECH carbon immersion silver pcb bulk production for wholesale

A-TECH carbon immersion silver pcb bulk production for wholesale

Thickness
0.2-0.65um
Shelf Life
6 Months
Solderability
Good
RoHS Compliant
Yes
Additional Cost
No
Supply Capacity
15000 ㎡/Month
Certifications
UL, ISO9001, TS16949
Payment Terms
T/T, Paypal, WU etc.
Shipment Terms
EXW, FOB, DDU etc.
Test Way
100% E-Test
Standard
IPC CLASS 2 / CLASS 3
Price
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Quantity Needed:
Pieces
E-mail:
Company Advantages
1. The inner components of A-TECH pcb gold plating are finely processed and optimized to achieve a better luminous effect. For example, its heat sink is processed with the improved aluminum substrate to achieve better thermal dissiaption. Being laminated by advanced vacuum lamination equipment, it has a uniform dielectric thickness after lamination
2. Customization service for our immersion silver pcb is available. The product is certified under UL(E357001) and RoHS
3. The product is internationally recognized for its excellent performance and long service life. It can be printed with numbers, names, data codes, logos, or other specific information
4. The product has reliable and consistent quality thanks to the detailed quality inspection throughout the whole production. Its working panel is coated with a photo-sensitive epoxy-based ink, which can ensure its insulation resistance
5. Its quality is qualified to meet the requirements of certifications. It can be manufactured with a customized thickness


OSP, the full name is Organic Solderability Preservative, it preserves the copper surface from oxidation by applying a very thin protective layer of material over the exposed copper usually using a conveyorized process. It uses a water-based organic compound that selectively bonds to copper and provides an organometallic layer that protects the copper prior to soldering. It’s also extremely green environmentally in comparison with the other common lead free finishes, which Suffer from either being more toxic or substantially higher energy consumption.

The typical thickness of OSP is 0.2 – 0.65um and the shelf life is 6 months. It’s a simple manufacturing process to make OSP, and like HASL finish, the production cost of OSP is lower than most of other surface finishes.



The applications of thick copper PCBs

● Cost effective / Low cost
● Simple process
● Excellent flatness
● Re-workable
● Clean, environmentally friendly process



The disadvantages of OSP

● Short shelf life
● Very sensitive to handling – gloves must be used and scratches avoided
● Short operating window between assembly stages
● Not suitable for multiple soldering processes
● Difficult to inspect or measure thickness



A-TECH own OSP line in house, it’s nowadays mainly used to build single-sided FR4 PCB or aluminum PCB with low cost requirements.




Company Features
1. A-TECH CIRCUITS Co., Ltd. has an experienced pcb gold plating development design and production team.
2. We are proud to support the economy of local communities in which we serve. We help local businesses to grow and expand through different ways such as financing. Please contact.
It helps reduce the risk of injury and improve work safety pcb gold plating make pcb gold plating practically and easy to operate.
pcb gold plating is pcb gold plating, and especially fits for the usage in pcb gold plating. The product features a high automation level, which helps reduce labor costs
immersion silver pcb adopts pcb gold plating materials, generate features such as pcb gold plating. It is widely used in electricity, telecommunications, electronic products, furniture industries and so on
The body of pcb gold plating is made by advanced pcb gold plating, which is pcb gold plating.
The unique immersion silver pcb material of pcb gold plating makes it a immersion silver pcb. With a robust structure, it does not vibrate during operation
The product has the advantage of great colorfastness. The material used lends itself to dying and holds dyes well without losing its color. The product adopts an innovative automatic programming system
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