PCB FACILITY TOUR
PCB Facility Tour / Multilayer PCB Manufacturing Process
At A-TECH CIRCUITS we recognize the importance of investing the state of the art automation equipments and keeping abreast of the new PCB manufacturing technology to provide our customers with high quality printed circuit boards and exceed customers’ expectation.
All of our manufacturing equipments is selected to provide high quality processing with efficient throughput and minimal changeover times, so that we’re able to achieve very low costs and extremely high yield rated output. Driven by our desire to increase efficiency and maintain product quality we are committed to continuing to invest in our manufacturing facilities to ensure that we remain our competiveness in the worldwide market. Currently we have complete manufacturing process for multilayer PCBs in house with an impressive range of PCB manufacturing equipments as introduced below in our plant.
Multilayer PCB begins its inner core production with a chemical pre-clean which removes any residual matter and oxidation. Panels are fed directly into the clean room environment where a dry or wet film resist is applied and queued for exposure. This streamlined process minimizes costly handling and related defects.
After exposure of artwork, multilayer PCB inner cores feed from clean rooms into an integrated system that develops, etches, and strips the inner layers. Inner layer process is to form inner layer circuitry of PCBs. This IS system is stainless steel and titanium. Computers control the parameters of the process, yielding consistent quality. Exiting the line is a finished core.
A-TECH use the most advanced Vacuum DES line in the industry, this is able to achieve the limit capability with minimum trace width/spacing 2/2mil, it’s extremely suitable to build multilayer PCBs with fine traces and high density.
Automated Optical Inspection (AOI) equipment is used to inspect all inner PCB layers before proceeding to the next step in PCB production. This process identifies opens, shorts, and reduced traces. It is better to locate these problems early in the process, prior to lamination.
A-TECH carry out 100% AOI inspection for every piece of inner layer core to ensure that no any potential quality defects before lamination.
This equipment is used to press PCB inner cores, prepregs and copper foils together to be multilayer PCB panels. It features hot oil heated beds with vacuum for outgassing. Load systems move the panels from the hot presses to the cold press/cool down stages of the process. The entire lamination process is computer controlled.
A-TECH use advanced vacuum lamination equipment which is able to guarantee the uniform dielectric thickness after lamination, this is extremely ideal for multilayer PCBs with impedance control requirements.
Drilling is very critical to the PCB manufacturing process, holes of various sizes are drilled through a stack of working panels and the drilling process is computer numerical control.
A-TECH use high speed CNC drill machines with 200000 r/min, and the machines include two spindles, four spindles and six spindles, this ensure that we’re able to handle orders from PCB prototype to high volume production with high efficiency.
In order for the through holes to electrically connect to different layers of the PCB, a thin layer of copper is chemically deposited into the through holes and on the surface of copper, this copper will later be thickened through pattern plating process.
A-TECH add a desmear section in PTH line to reduce the roughness of through hole and guarantee high quality of plated copper in the holes.
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